The research results indicated that with the increase of treatment power ,treatment time and treatment pressure,the surface etching deepened and expanded from non crystalline region to crystalline region,the etching stripes became well-observed, and the surface roughness increased.
结果表明随处理功率增大、处理时间增长和处理压力增高,表面刻蚀随之加深,刻蚀由非晶区向晶区发展,刻蚀条纹渐趋明显,表面粗糙度增加。
The impact of mesa etching on the device characteristics of power SITH;
台面刻蚀对电力SITH器件特性的影响
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