overall thickness

This paper studies the influence rule of the blade's vibration and the surface roughness, warp, total thickness variation (TTV) of the wafers, study the abrasi.

本文系统研究了内圆锯切过程中,锯片振动对硅晶片表面粗糙度、弯曲度、总厚度变化(TTV)的影响规律。